Mainboard ASROCK Intel B860 Express LGA1851 ATX Memory DDR5 Memory slots 4 1xPCI-Express 4.0 16x 1xPCI-Express 5.0 16x 1xM.2 1xHDMI 1xDisplayPort 1xAudio-In 1xAudio-Out 1xMicrophone 2xUSB 2.0 6xUSB 3.2 1xUSB-C 1xRJ45 B860PRO-AWIFI

Pro-A series is designed for enhanced stability, durability, and efficiency, it offers reliable performance, user-friendly features and a streamlined aesthetic, making it ideal for daily computing needs.

Hi-Density Power Connector
CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.

10+1+1 Power Phase Design
Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.

Dr. MOS
Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.

DDR5 XMP & EXPO Support
Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory overclocking performance by enabling the pre-tested profiles. Make sure the memory modules are Intel® XMP/AMD EXPO™ capable and overclocking can be made so affordable, satisfying and absolutely no sweat at all.

PCIe Gen5 Blazing M.2
The Blazing M.2 accommodates the latest PCI Express 5.0 standard to perform twice the bandwidth compared to previous generation, with a breathtaking 128Gb/s transfer speed, it is ready to unleash the full potential of future ultrafast SSDs.

Aluminum Heatsink
The first thing that catches the eye is the optimized Aluminum Heatsink Design. Heatsinks are crucial for efficient heat dissipation, especially during heavy workloads like gaming or productivity tasks. Motherboard that built with heatsinks can effectively manage thermal performance, hence ensure system stability and durability effortlessly.

Wi-Fi 6E 802.11axe
WiFi 6E technology has extended to the whole new 6GHz spectrum band, providing more WiFi capability and giving an even better and faster internet traffic. In addition to deliver higher speeds, the WiFi 6E also enhances the lower latency and supports service levels that are equivalent to 5G networks.

Dragon 2.5 Gb/s LAN
The intelligent 2.5Gb/s LAN platform is built for maximum networking performance for the demanding requirements of home networking, content creators, online gamers and high-quality streaming media. Boost networking performance up to 2.5X the bandwidth compared to the standard gigabit Ethernet, you’ll enjoy the faster and uncompromised connectivity experience for gaming, file transfers and backups.

POLYCHROME RGB
This motherboard features onboard RGB headers and addressable RGB headers that allow motherboard to be connected to compatible LED devices such as strip, CPU fans, coolers, chassis and so on. Users may also synchronize RGB LED devices across the Polychrome RGB Sync-certified accessories to create their own unique lighting effects.

Summary: Asrock B860 Pro-A WiFi. Processor manufacturer: Intel, Processor socket: LGA 1851 (Socket V1). Supported memory types: DDR5-SDRAM, Maximum internal memory: 256 GB, Memory slots type: DIMM. Supported storage drive interfaces: M.2, SATA III, RAID levels: 0, 1, 5, 10. Graphics card family: Intel. Ethernet interface type: 2.5 Gigabit Ethernet, LAN controller: Dragon RTL8125BG, Top Wi-Fi standard: Wi-Fi 6E (802.11ax) | Vendor Homepage: https://asrock.com/MB/Intel/B860%20Pro-A%20WiFi/index.asp#Overview | Motherboard chipset: Intel B860 | Audio chip: Realtek ALC897 | Component for: PC | Motherboard form factor: ATX | Audio output channels: 7.1 | Motherboard chipset family: Intel | Windows operating systems supported: Windows 11 x64 | Processor manufacturer: Intel | Processor socket: LGA 1851 (Socket V1) | Supported memory types: DDR5-SDRAM | Number of memory slots: 4 | Memory slots type: DIMM | Memory channels: Dual-channel | ECC сompatibility: Non-ECC | Maximum internal memory: 256 | Unbuffered memory: Yes | Supported storage drive interfaces: M.2,SATA III | RAID support: Yes | RAID levels: 0/1/10/5 | On-board graphics card: Yes | Graphics card family: Intel | USB 2.0 connectors: 2 | USB 3.2 Gen 1 (3.1 Gen 1) connectors: 2 | Number of SATA III connectors: 4 | Front panel audio connector: Yes | CPU fan connector: Yes | Number of CPU fan connectors: 2 | Number of chassis fan connectors: 4 | TPM connector: Yes | RGB LED pin header: Yes | USB 2.0 ports quantity: 2 | USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity: 6 | USB 3.2 Gen 2x2 Type-C ports quantity: 1 | Ethernet LAN (RJ-45) ports: 1 | HDMI ports quantity: 1 | DisplayPorts quantity: 1 | DisplayPort version: 1.4 | Line-in: Yes | Microphone in: Yes | Ethernet LAN: Yes | Ethernet interface type: 2.5 Gigabit Ethernet | LAN controller: Dragon RTL8125BG | Wi-Fi: Yes | Top Wi-Fi standard: Wi-Fi 6E (802.11ax) | Wi-Fi standards: 802.11a/802.11b/802.11g/Wi-Fi 4 (802.11n)/Wi-Fi 5 (802.11ac)/Wi-Fi 6 (802.11ax)/Wi-Fi 6E (802.11ax) | Bluetooth: Yes | Bluetooth version: 5.3 | PCI Express x16 (Gen 4.x) slots: 1 | PCI Express x16 (Gen 5.x) slots: 1 | Number of M.2 (M) slots: 1 | BIOS type: UEFI AMI | BIOS memory size: 256 | Width: 305 | Depth: 244 | Cables included: SATA | Unit Calculated Weight: 1.82 | Product Net Weight: 1.4 | Unit Calculated Volume: 0.008784 | Units per Shipping Box: 5 | Unit Width: 28 | Shipping Box Height: 30.5 | Unit Depth: 35.5 | Unit Height: 7.5 | Name: MB B860 S1851 ATX/B860 PRO-A WIFI ASROCK | Model: B860 Pro-A WiFi